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Freescale i.MX6 Cortex-A9 : PICO-IMX6POP-SD | TECHNEXION

Specifications Processor Freescale i.MX6 Dual / Quad Package-on-Package (PoP) Technology ARM Cortex-A9 dual/quad core @ 1Ghz Power Management IC Freescale MMPF0100 System Memory 512MB or 1GB LPDDR2 Storage micro-SD Cardslot Operation System Linux 3.x, Yocto, Android 4.3, Android 4.4, Android 5.0,...

Specifications

Processor	Freescale i.MX6 Dual / Quad Package-on-Package (PoP)
Technology	ARM Cortex-A9 dual/quad core @ 1Ghz
Power Management IC	Freescale MMPF0100
System Memory	512MB or 1GB LPDDR2
Storage	micro-SD Cardslot
Operation System	Linux 3.x, Yocto, Android 4.3, Android 4.4, Android 5.0, Ubuntu

Connectivity

Gigabit Network RGMII	Signals routed to board-to-board connector
Wireless LAN	Broadcom BCM4335 802.11ac
Bluetooth	Broadcom BCM4335 Bluetooth v. 4.0

Connectors

Board-to-Board

1x Intel Edison compatible connector (Hirose 70-pin)
2x Hirose 70-pin connectors

I/O Interface Signalling

Edison I/O @ 1.8V	9x GPIO 4x PWM 2x I²C 1x I²S 1x SPI 2x UART USB-OTG SDIO (4-bit)
Additional I/O @ 3.3V	Single Channel LVDS 24-bit TTL RGB HDMI 1.4 MIPI CSI Camera MIPI DSI Display PCIe SATA II RGMII (gigabit LAN) Flex CAN version 2.0B Compliant

Video

GPU 3D	Vivante GC2000 200Mtri/s 1000Mpxl/s Open GL ES 2.0 & Halti, CL EP
GPU 2D (Vector Graphics)	Vivante GC355 300Mpxl/s OpenVG 1.1
GPU 2D (Composition)	Vivante GC320 600Mpxl/s, BLIT
Video Decode	1080p60 H.264
Video Encode	1080p30 H.264 BP / Dual 720p

Audio

Interface	I²S (1 channel)
Audio Codec	On Carrier Board

Power Specifications

Input Power Requirements

3.3 ~ 4.5 VDC

Environmental and Mechanical

Temperature	Commercial : 0° to 60° C Extended : -20° to 70° C Industrial : -40° to 85° C (no WiFi possible)
Humidity	10 - 90%
Dimensions	36 x 40 mm 1⅜ x 1⅝ inch
Weight	8 grams
Certification	Compliant with CE, FCC, RoHS, REACh directives

Applications :

CPU	Freescale i.MX6 Solo / Duallite
Mémoires	512MB ou 1GB LPDDR2

CPU	Freescale i.MX6 Solo / Duallite
Mémoires	512MB ou 1GB LPDDR2