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Freescale i.MX6 Cortex-A9 : PICO-IMX6POP-EMMC | TECHNEXION

Specifications Processor Freescale i.MX6 Dual / Quad Package-on-Package (PoP) Technology ARM Cortex-A9 dual/quad core @ 1Ghz Power Management IC Freescale MMPF0100 System Memory 512MB or 1GB LPDDR2 Storage onboard eMMC (default 4GB) Operation System Linux 3.x, Yocto, Android 4.3, Android 4.4,...

Specifications

Processor	Freescale i.MX6 Dual / Quad Package-on-Package (PoP)
Technology	ARM Cortex-A9 dual/quad core @ 1Ghz
Power Management IC	Freescale MMPF0100
System Memory	512MB or 1GB LPDDR2
Storage	onboard eMMC (default 4GB)
Operation System	Linux 3.x, Yocto, Android 4.3, Android 4.4, Android 5.0, Ubuntu

Connectivity

Gigabit Network RGMII	Signals routed to board-to-board connector
Wireless LAN	Broadcom BCM4335 802.11ac
Bluetooth	Broadcom BCM4335 Bluetooth v. 4.0

Connectors

Board-to-Board

1x Intel Edison compatible connector (Hirose 70-pin)
2x Hirose 70-pin connectors

I/O Interface Signalling

Edison I/O @ 1.8V	9x GPIO 4x PWM 2x I²C 1x I²S 1x SPI 2x UART USB-OTG SDIO (4-bit)
Additional I/O @ 3.3V	Single Channel LVDS 24-bit TTL RGB HDMI 1.4 MIPI CSI Camera MIPI DSI Display PCIe SATA II RGMII (gigabit LAN) Flex CAN version 2.0B Compliant

Video

GPU 3D	Vivante GC2000 200Mtri/s 1000Mpxl/s Open GL ES 2.0 & Halti, CL EP
GPU 2D (Vector Graphics)	Vivante GC355 300Mpxl/s OpenVG 1.1
GPU 2D (Composition)	Vivante GC320 600Mpxl/s, BLIT
Video Decode	1080p60 H.264
Video Encode	1080p30 H.264 BP / Dual 720p

Audio

Interface	I²S (1 channel)
Audio Codec	On Carrier Board

Power Specifications

Input Power Requirements

3.3 ~ 4.5 VDC

Environmental and Mechanical

Temperature	Commercial : 0° to 60° C Extended : -20° to 70° C Industrial : -40° to 85° C (no WiFi possible)
Humidity	10 - 90%
Dimensions	36 x 40 mm 1⅜ x 1⅝ inch
Weight	8 grams
Certification	Compliant with CE, FCC, RoHS, REACh directives

Applications :

CPU	Freescale i.MX6 Solo / Duallite
Mémoires	512MB ou 1GB LPDDR2

CPU	Freescale i.MX6 Solo / Duallite
Mémoires	512MB ou 1GB LPDDR2